Wire Bond Assembly Operator

Purpose: Work for a world leader in advanced semiconductor packaging technologies that works with flip chip assembly, fine-pitch wedge and gold ball wire bonding, stacked die assembly, precision wafer dicing, individual die singulation and dicing of unusual materials.

Candidates will be responsible for silicon die handling, material dispensing and curing, furnace profiling, microscope use, using wafer dicing saw, using K&S Maxum Ballbonder/ESEC, Asymtek Dispense System, performing basic mathematic calculations, and monitoring and operating computerized assembly equipment for the assembly of integrated circuits.

Qualified candidates will have experience with semi-conductor assembly and production processes, wire bond, wafer-saw, die-attach, the ability to understand schematics and shop orders, experience with microscopes and digital cameras, and 3rd Op inspection capabilities.

Classification:
Contract-to-Hire

Compensation:
DOE Hour

Join Aerotek CESM, one of the leading providers of engineering and engineering support professionals in North America. Due to our growth, we're constantly on the lookout for qualified professionals to place in contract, contract-to-hire, and permanent placement positions across a number of different industries. We know it's more than just your day-to-day responsibilities that can make or break a job. It's the support you get. That's the reason Aerotek CE offers a variety of benefits including medical, dental, optical, 401k, and many more. Don't put your career in the hands of just anyone, put it in the hands of a specialist. Join the Aerotek CE team! Allegis Group and its subsidiaries is an equal opportunity employer.

Required Qualifications:
Skills Requirements:
Wire Bond, wafer saw, die attach, semiconductor assemblyContact Information
Contact:Ruis,William B