Electronic Assembler II/III

Ranked by the Rocky Mountain News as Colorado's Best Company (2006), EchoStar aggressively recruits energetic, driven, intelligent people to meet the demands of our exciting industry and to help us reach our vision of changing the way the world communicates. To add to our team of talented people, we are currently seeking a Electronic Assembler II/III within our Engineering department.





Specifically, duties include (but are not limited to):
Ability to install through a hole and surface mount components on printed circuit boards following a BOM.

Fits together electrical/electronic parts according to specified sequence. Tests moving parts, sub-assemblies, or components to detect defective parts or faulty operation.
Adjusts or repairs parts, sub-assemblies, or components to attain specified functional performance.
Performs the removal and installation of J-lead, Flat ribbon, L and Gull Wing ultra fine pitch components (less than 20 miles) using conventional soldering equipment and/or hand soldering methods.
Performs the removal and installation of BGA (Ball Grid Array) IC’s.
Has knowledge of and understands the use, maintenance, component profiling, alignment methods and stenciling of BGA components.


The Electronic Assembler II/III benefit from:
FREE satellite TV system and programming
Medical, dental, and vision insurance
Flexible spending options and employee assistance plan
401(k) and employee stock purchase plan
Tuition reimbursement
Employee referral program
Training opportunities
Opportunity for a level of responsibility that could take years to reach in other companies




job Requirements


Minimum qualifications to be considered are:



Education:High school diploma or general education degree (GED); and 2 year related experience and/or training; or equivalent combination of education and experience.


Experience: Minimum of 2 years experience and/ or training performing various and more complex assembly skills such as removal and installation of ultra fine pitch surface mount (SMT) components and BGA (Ball Grid Array) components.


Skills: Good written and oral communication skills. Capable of using and maintaining soldering and desoldering equipment. Proficient with Microsoft windows and other applications preferred. Ability to read and interpret documents such as safety rules, operating and maintenance instructions, and procedure manuals. Ability to write routine reports and correspondence. Ability to speak effectively before groups of customers or employees of organization.



If you are inspired by opportunity, take pride in results, and strive to win, we invite you to apply today!