Process Engineering Manager, Wafer Fabrication

MAJOR SPECIFIC DUTIES/RESPONSIBILITIES:

·Provide technical and managerial leadership for the process engineering group.
·Coordinate testing and qualification for any new process introduction.
·Lead projects to reduce costs or increase capacity, as strategy dictates.
·Interface with Development and Product Engineering groups for introduction of new products.
·Assist in training/coaching of department personnel.
·Provide direction in testing and analysis methods for DOEs and process improvement tests.
·Assist with troubleshooting and failure analysis to determine root causes of process issues.
·Lead group meetings, presenting group achievements in front of large groups.
·Gain support for project ideas from upper management.
·Lead process engineering efforts to improve the health and safety of the work environment.

SECONDARY DUTIES/RESPONSIBILITIES:

·Participate and contribute to meeting compliance and certification for ISO 9000-2000, ISO14000 and TS16949
REQUIREMENTS
FACTORS:
KNOWLEDGE/EDUCATION REQUIRED:

§BS in Physics, Chemical or Electrical Engineering.
§Knowledge of DOE and SPC techniques.
§Green Belt or Black Belt certification is preferable.
§Computer skills with MS Office Suite.


SKILLS PERFERRED:

§5 – 10 years Semiconductor Wafer Fab process engineering experience
§Diffusion
§Photolithography
§Wet chemical and plasma processing
§Device engineering


PHYSICAL REQUIREMENTS:

·Capable of working in a Semiconductor manufacturing environment including exposure to chemicals and gasses within OSHA P.E.L. limits.

RESPONSIBILITY FOR COSTS:

·To include developing, tracking and reporting on a annual department budget.
·Developing and implementing cost reduction projects as well as managing projects within the department.

ACCOUNTABILITY:

·Reports directly to the Wafer Fab Manager.