Manager of New Product Development

Purpose and Scope: Organize / hire a team of product, assembly and plating engineers to deliver a new high volume RFID product to market. Qualify and deliver product from contract manufacturing sources for wafers, assembly and antenna. Set up in house capability for assembly, test and antenna manufacturing.

Responsibilities: Interface with marketing, design and foundry to insure high quality low cost product is made to the customer specification on time and on budget. Hire the engineering team necessary to cover foundry service, contract manufacturing and in house manufacturing.

Organization Relationships Reports directly to CEO
REQUIREMENTS
Job Requirements:

A.Education and Training: BS / MS Electrical Engineering with electronics emphasis


B.Technical Requirements: Must have successfully taken a new product from wafer fab out to volume customer shipments. Hands on experience with high volume low cost final test, assembly and yield improvement. Direct experience with foundry sourced wafers. Some process engineering experience desirable. Should have experience with mixed signal and RF.

C.Managerial Experience: Experience managing a small group. Project management experience also required


D.Critical Skill Set: Organization, technical understanding, management


Additional Details:


A.Years of Experience: 5 – 10 years product engineering, 1 -3 years managing a group

B.Relevant Experience: Product engineering, particularly in analog or mixed signal environments.