Principal Packaging Engineer

Engineering R&D
Reports to: Director, Central EngineeringJob Summary:
A Principal Packaging Engineer works independently or as part of a multi-discipline team to develop world-class military systems. Conceptualization and detailed MCAD design of electronic packages including circuit boards, cabeling, enclosures and interconnections to meet technical requirements.Responsibilities to Include:
Will work with circuit design engineers to partition systems to achieve high-performance, cost-effective packages.
Preparing complex design layouts, detail drawings, assembly drawings and other project documentation using contemporary computer aided tools.
Aids in selection of components, materials, finishes and shop processes necessary to meet design requirements.
Performs design calculations and tolerance studies.
May direct other engineers or technical support personnel within design related activities such as thermal or structural simulations and laboratory evaluations.
Will interface with external suppliers and fabricators as required.
Responsible for creating mechanical designs compliant with technical requirements pertaining to, structural, thermal, manufacturing, fabrication, assembly, testing and other constraining attributes or features.
Select or support selection of: components, materials, finishes and shop processes.
Create and manage BOMs, ECNs and other design documentation.
Develop customer specific solutions for mounting/packaging electronic equipment.
Work with qualification and regulatory organizations to ensure that products meet safety requirements.
Provide cost and schedule inputs for proposals.
Produce designs within cost and schedule agreements.
Determine suppliers required to produce specific designs including those specific to packaging including cables, connectors, metal and plastics fabricators as well as circuit board assembly suppliers.A Textron Company
REQUIREMENTS
BS in Mechanical Engineering.
MS in Mechanical Engineering preferred.Position Requirements:
Have at least ten years of experience in military electronics packaging industry at the system level.
A working knowledge of NX is preferable, however, NX training will be provided.
Self-motivated - works equally well independently or in a team environment.
Excellent communication and organizational skills.
Proven ability to take design from concept to deployed product.
Familiar with DoD standard drawing practices and Mil Specs.
Working knowledge of ASME Y14.5M.
Strong computational skills.
familiarity with DFM / DFA techniques in finalizing designs.
Experience using rapid prototype models (plastic models) to reduce design risks and overall design cycle-time.
Willing to travel.
Structural & thermal design analysis capability is very desirable.License and Certification Requirements:
none
Additional Information:
FLSA Status: Exempt
Direct Reports: 0
Travel Requirements: 0%