Design Project Manager

MAJOR SPECIFIC DUTIES/RESPONSIBILITIES:
·Design semiconductor die for circuit protection devices.
·Evaluate design concepts with semiconductor modeling, either directly or through a modeling engineer.
·Provide detailed photomask design information to drafting and slice layout personnel.
·Work with Process Engineering to provide initial wafer processing specifications (travelers).
·Drive new product introductions by leading these activities:
·Work with Process and Package Design Engineers, Product Engineers and Product Managers to formulate Product Development Proposals.
·Assemble and document new product requirements into Product Design Specifications (PDS’s).
·Lead investigations to determine and document the feasibility and risks of developing certain new products. Feasibility studies may include estimating product manufacturing costs and margins, assessing capital equipment needs and performing payback analysis, exploring the technical and market risks and providing preliminary resource requirements and timeline estimates.
·Present Phase 1 feasibility studies and make recommendations for proceeding with or abandoning the development of certain new products.
·Coordinate the design and development efforts of the team to establish a design and manufacturing scheme that will produce products in compliance with the PDS. This may include organizing DFMEA and PFMEA exercises, designing DOE’s, coordinating prototype production and modeling, and ordering needed tests and reports from internal and external labs.
·Coordinate the research behind and the drafting of requirements for capital requests to senior management.
·Communicate project status and issues to management through monthly reports, design and status review meetings and other means as needed.
·Ensure that new products meet the objectives and requirements specified in the business plan and the Product Design Specification (PDS) and that all work is documented according to the 3-Phase Development Process.·Team Leaders are expected to maintain good communication on objectives and goals of the project. (Teams may be comprised of personnel from Engineering, Purchasing, Vendors, Marketing and Operations.) Hold regular team meetings. Record, publish, and track action items developed in meetings. Much of this work cannot be done in person. Effective use of e-mail and telephone conferences is essential for success.
·Manage projects to assure coordination between manufacturing groups. This will include inside foundries, outside foundries, inside and outside packaging and testing resources.·Drive interim design reviews as needed to determine manufacturability and to keep projects on track.
·Prepare the Design Review Report for the Phase 2 Design & Development Review Meeting.
·Work closely with Operations during the Phase 3 validation and launch of new products into production to track product performance to established criteria/targets.*Other duties that may arise in the course of employment as designated by the supervisor or manager. *SECONDARY DUTIES/RESPONSIBILITIES:
§Some travel will be required.
REQUIREMENTS
FACTORS:
KNOWLEDGE/EDUCATION REQUIRED:
·Degree required: BS in an engineering degree or Physics
·Project management experience: 3-5 years.
·Semiconductor design experience: 3-5 years.
·Proficiency in MS Office Suite Programs (Word, Excel, PowerPoint)SKILLS PERFERRED:
·SolidWorks
·AutoCAD
·MiniTAB
·Analog circuit design and analysis
·Semiconductor device experience: Design, Test / Characterization, Applications, Processes
·Foreign Language Skills: English & Mandarin Chinese
DIRECTION/SUPERVISION RECEIVED:This is a leadership position. The individual will be required to schedule their own work and accomplish their mission with minimal direct supervision.